Device overview - Qualcomm Dragonwing Documentation

The Dragonwing IQ-8275 EVK features the Qualcomm Dragonwing™ IQ-8275 SoC, part of the IQ8 Series. This processor is engineered to deliver exceptional AI performance for industrial-grade applications operating in extreme environments. Designed for compute-intensive workloads, robotics, and edge AI, the IQ-8275 combines high-performance processing, advanced multimedia capabilities, and robust connectivity—all within a power-efficient architecture. Top View:

Side View:

Introduction

The Dragonwing IQ-8275 EVK incorporates a system-on-module (SoM) featuring the Qualcomm IQ-8275 system-on-chip (SoC). This SoM is mounted on the mainboard, which provides connectors for multiple peripheral interfaces and supports stackable mezzanine cards for expanded functionality. The platform is designed to manage concurrent compute and AI workloads efficiently. Key Features:

System-on-Module (SoM)
- Integrates the Qualcomm IQ-8275 SoC.
- Mounted on the mainboard for modular design.
- The IQ-8275 SoC is integrated within the IQ-8275M module, which also houses two PMICs and two LPDDR5 SDRAM memory components.
Mainboard Capabilities
- Provides connectors for various peripheral interfaces.
- Supports stackable mezzanine cards for expansion.
Performance and Workload Management
- Handles multiple concurrent compute and AI workloads efficiently.
Peripheral Support
- Integrated Ethernet, USB, Wi-Fi, PCIe, and Bluetooth.
AI Performance
- Delivers up to 40 INT8 TOPS, enabling high-performance AI-centric and edge computing applications in industrial environments.

The following figure shows the location of the different connectors on the mainboard. It also shows the main components and ports including the power plug, power on-off switch, DIP switches, camera interfaces, USB ports, debug UART port, Ethernet port, and display ports.

Device specifications

Category	Details
Processor & Compute	CPU: Octa-core Kryo™ Gen 6 (2× Prime @ 2.35 GHz, 2× Gold @ 2.1 GHz, 4× Silver @ 1.95 GHz) GPU: Adreno™ 623 (up to 877 MHz)
AI Engine	Dual Hexagon Tensor Processors Up to 40 TOPS AI performance Supports LLMs (e.g., Llama2 13B at ~12 tokens/sec)
Real-Time Subsystem	Quad real-time cores @ 1.85 GHz for low-latency control
Memory & Storage	RAM: Up to 12 GB LPDDR5 @ 3200 MHz with inline ECC Storage: UFS 3.1 (up to 128 GB), NVMe via PCIe
Multimedia	Camera Support: Up to 12 concurrent cameras Display Support: Up to 12 displays (e.g., 5× 4K60, 8× 1080p60) Video Decode: 2× 4K60, 4× 4K30, 8× 1080p60, 16× 1080p30 (Formats: AV1, H.264, H.265/HEVC, VP9, MPEG-2) Video Encode: 1× 4K60, 2× 4K30, 4× 1080p60, 8× 1080p30 (Formats: H.264, H.265/HEVC)
Connectivity	Ethernet: 2× 2.5 GbE Wireless: Wi-Fi 6E, Bluetooth 5.3 I/O Interfaces: PCIe, USB, CAN-FD, GPIO, UART, MIPI CSI/DSI
Operating Temperature	Industrial-grade: Ambient: -40°C to +105°C Junction: up to +125°C
Target Applications	Factory Automation Edge AI and Generative AI Robotics and industrial automation Multi-camera vision systems Autonomous Mobile Robots (AMRs) Industrial gateways

Hardware Specifications

The following table outlines the key hardware specification of the Dragonwing IQ-8275 EVK.

Interface or feature	Description
SoC	IQ-8275 (part of IQ-8275M)
Memory	4 × 16 bit 12 GB LP5 3200 MHz (2 x 6 GB LPDDR5)
PMIC	2 × PMM8620AU (part of IQ-8275M)
External MCU	Not present
Storage	1 × 128 GB UFS, micro-SD card, EEPROMs for MACs, eMMC on mezzanine card
Display	Four display ports: • 2 × mini-DP (one with MST) • 2 × DSIs (one to DSI flex, one to expansion) DSI flex connection with touchscreen
Camera/Video input	3 × Quad deserializers 3 × CSI (C-PHY or D-PHY) ports
USB	USB0 Type-C (host or device mode) USB1 Type-C (host mode) USB2 micro-USB 2.0 (host or device mode)
WLAN/Bluetooth®	m.2 module (NFA765A) 2 × printed antennas (Bluetooth shared with one WLAN antenna)
PCIe	Mainboard supported or expanded options (selected through switch): • 1 × PCIe x4 slot or expansion (switch) • 1 × m.2 E key (Wi-Fi) or expansion (switch)
Audio	1 × I2S mic 2 × I2S speaker amps Additional I2S on GPIOs
Ethernet	RJ45 2.5 GbE SGMII
CAN/CAN-FD	1 × CAN/CAN-FD on low speed header on mainboard
Low-speed expansion	3.3 V header for developer community with CAN, SPI, I2C, UART, I2S
Second low-speed expansion	QUPs and GPIOs on mezzanine connectors
Sensors	IMU: ICM-42688 QUPs on expansion
Trusted platform module (TPM)	ST33HTPH2x32AHE4 on mainboard

Components included in the kit

Packaging:

Dragonwing IQ-8275 EVK
Top cover of the EVK with a mini screwdriver
Power supply with Type-C to barrel plug adapter
USB Type-C cable with Type-A adapter
Micro USB cable with Type-A adapter
Mini DisplayPort to DisplayPort cable
Two mini speakers
PCIe edge card adapter for NVM Express (NVMe)
Pick tool to access DIP switches
Pin row header for low speed connector

System Block Diagram

This figure provides a visual representation of the platform’s architecture, highlighting the main components and their interactions on the Dragonwing IQ-8275 EVK platform.

For more detailed hardware information, refer to the QCS8275 Data Sheet (80-73475-1) and IQ-8275 EVK documentation.

Next steps

With the board unpacked and the layout understood, the first thing to do is install the latest software. Continue to Update software.

​Introduction

​Device specifications

​Hardware Specifications

​Components included in the kit

​System Block Diagram

​Next steps